| 講演要旨: |
Oxides have always been an integral part of semiconductor manufacturing both in front and back-end processing. With the necessary increase in performances, the demand on these oxide has been increasing leading to their (future) replacement by more complex materials, such as high-k’s in gate oxide and low-k’s in interconnects. With the material complexity, a thorough characterization of all aspects of these materials is necessary, covering, for instance, surfaces and interfaces, nucleation, growth, atomic structure, …. This presentation will mainly focus on the characterization of front-end oxides and their interfaces. We will first focus on the determination of substrate surface preparation conditions before deposition ad their influence on growth mode, including the influence of the growth technique (ALD, MOCVD, MBE, …). Second, we will cover the measurement of film thickness and density before covering the difficulties to achieve composition depth profiling with the necessary depth resolution. Finally, we will cover the characterization of electronic properties, such as band-gap and band-offset. |