| 講演要旨： |
Debonding of interfaces and cracking of fragile thin films effects the mechanical integrity of a wide range of thin-film device structures, including microelectronic interconnects, micro-actuators, and biosensors. This results in reduced yield at all levels of device processing including survival through chemical mechanical planarization and subsequent device packaging. Unique challenges for such emerging technologies involve the effects of interfacial chemistry on adhesion, the introduction of new nanostructured materials and the effect of feature architecture including length-scales and aspect ratios. In this lecture, the mechanical and fracture behavior of representative blanket and patterned thin film structures including glass and organic layers, barriers and metal layers, are examined. Particular attention is given to emerging classes of low- and ultra-low interlayer dielectric constant materials for microelectronic interconnect applications. The acceleration of crack growth in complex chemical environments typically encountered during processing is discussed. The effects of interface parameters and thin-film composition and porosity will also be considered. Novel strategies to strengthen and toughen fragile nanoporous materials using molecular remnants and curing treatments are described. Finally, the effect of more complex patterned thin-film structures are examined where length scales are restricted in more than one dimension. Implications for device reliability, integration of new materials, and life prediction are discussed. |
