The 21st Century COE Program | ||
Center of Excellence for Research and Education on Complex Functional Mechanical Systems |
日時: | 2005年09月02日(金) 10:00〜12:00 |
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場所: | 京都大学 工学部物理系校舎 1階 122会議室 |
講演者: | 斉藤 万裕 (ミシガン大学機械工学科 準教授) |
講演題目: | Design for product-embedded disassembly (分解法埋め込み型製品の設計) |
講演要旨: |
This talk discusses our attempts towards design for product-embedded disassembly, a new approach to Design for Disassembly that aims at designing products with built-in disassembly means to be activated at the end of product life cycle. The talk consists of two parts: 1) the design of a new class of joints that can be detached by the application of localized heat, and 2) the design of assemblies that can disintegrate via a domino-like process triggered by the removal of one or few fasteners. The first half of the talk presents a method for designing a new class of joints, heat-reversible snaps, which allow easy, non-destructive, and clean detaching between internal frames and external panels in automotive bodies. While the assembly process is analogous to normal locator-snap systems, the heat-reversible snaps can be unlocked non-destructively upon heating the panel at a certain location, via the non-uniform thermal deformation of the panel. The optimum number and locations of the locators on the given panel are found based on the equivalent springs that represent the stiffness of the locator. Then, the locations of snaps and heating that ensure unlocking upon heating of the minimum area on the panel are obtained. The second half of the talk presents a method for designing assemblies, where the relative motions of components are constrained by the locators (tabs, slots, lips, rests, etc) integral to the components, in such a way that the removal of one or few fasteners would cause the self-disintegration of the assembly in a unique sequence, much like the domino effect. Given component revenues and components to be retrieved, the method simultaneously determines the spatial configurations of components and locator features on the components, such that the product can be disassembled in the most profitable sequence. |
京都大学大学院 | 工学研究科 | 機械理工学専攻 | マイクロエンジニアリング専攻 | 航空宇宙工学専攻 |
情報学研究科 | 複雑系科学専攻 | |||
京都大学 | 国際融合創造センター | |||
拠点リーダー | 土屋和雄(工学研究科・航空宇宙工学専攻) |